Silicon Photonics will revolutionize optical communication
Traditionally transceivers are built with optical subassemblies containing multiple components made of materials that are often expensive to purchase and challenging to process. Also these components need to be individually packaged and then repackaged into a hermetically sealed optical assembly.
In Silicon Photonics this optical subassembly is replaced by an optical chip. On this chip all components of a traditional subassembly are replaced by structures in silicon. This chip can then be fabricated just like an electronic chip enabling low cost high volume manufacturing.
The precision of the manufacturing process of optical chips in Silicon Photonics allows for huge miniaturization making it possible to develop transceivers that enable higher port density in optical networking equipment and consume less power than traditional transceivers.More about silicon photonics
Caliopa raises 1.3 million Euros
Zwijnaarde (Belgium) – April 9, 2012 – Silicon Photonics company Caliopa announced today it has raised 1.3 million Euros from its current investors to finalize the development of its Silicon Photonics platform and the first product derived from it. The investors in this capital...Read more
IWT supports innovation project Caliopa
Zwijnaarde (Belgium) – November 11, 2010 – The “agentschap voor Innovatie door Wetenschap en Techniek (IWT)” has decided to support Caliopa’s innovation project “Silicon Photonics for Optical transceivers” (SPOT) for the amount of 1.4 million Euro. In cooperation with imec, Caliopa...Read more